Materials for Hemetic Seal,Lead Frame,Package Seal,Anode Button,Shadow Mask Studpin and Electronic Component 
HOME >
PRODUCTS >
| Materials |
Enterprise Alloy Symbol |
Related Specification | Composition | Features |
Electrical
Resistivity （10-8Ω·ｍ） |
Density （Mg/m3） |
Average Thermal Expansion Coefficient ɑ（×10-6/K） |
（Temp.range) （K） |
Applications | ||||||
| Iron-Nickel-Cobalt Alloys |
UM-NCF-2 UM-NCF-4 UM-NCF-6 UM-NCF-15 UM-NCF-25 UM-NCF-30 |
ASTM F15 KV |
29Ni-16Co-Fe other | Good Sealing toHard Glass |
48 48 48 59 80 57 |
8.2 8.2 8.2 8.2 8.2 8.1 |
KV-2 KV-4 KV-6 KV-15 KV-25 KV-30 |
4.5~5.1 6.5~7.4 4.6~5.2 3.0~4.0 1.0~2.0 ≒5.0 |
（303~673） （303~673） （303~673） （303~673） （303~473） （303~673） |
Hermetic Seal,IC Lead Frames，CRT Gun Parts | |||||
| Silver Solder Clad Iron-Nickel-Cobalt Alloys | UM-ACKV72 | ―― |
(72Ag-Cu） Silver Solder |
KV-6 | Easy Brazing and Easy Seam Welding | ―― | ―― |
Silver Solder
Thickness KV-6
Thickness
Vickers Hardness（HV）
|
0.01~0.05mm 0.1~0.05mm 200~250（KV-6） |
Hardened
|
Package Sealing | ||||
| UM-ACKV85 | ―― |
(85Ag-Cu） Silver Solder |
KV-6 | ||||||||||||
| Nickel Clad lron-Nickel-Cobalt Alloys | UM-NKN1 | ―― | Ni | KV-2 | Ni | Easy Seam Welding（Equivalent to Ni-Plated Alloys） | 37 | 8.4 | 4.5~5.1 | （303~673） | |||||
| Iron-Nickel Alloys | UM-Alloy30 | ―― | 30Ni-Fe | Good Adhesion to Resin | 83 | 8.1 | 14.0~160.0 | （303~473） | Lead for Tantalum Chip Capacitars | ||||||
| UM-Alloy42 |
ASTM
F30 Alloy42 |
42Ni-Fe | Goodsealing to Soft Glass | 64 | 8.2 | 4.5~5.3 | （303~598） | IC Lead Frames,Hermetic Seal, CRT Gun Parts | |||||||
| UM-Alloy50 | ―― | 50Ni-Fe | 43 | 8.4 | 9.4~10.0 | (303~653) | CRT Gun Parts,Hermetic Seal | ||||||||
| Lron Nickel-Chromium Alloys | UM-NCF42 |
ASTM
F31 Alloy426 |
42Ni-6Cr-Fe | High Sealing Strength(Compared to KV,D-1,NS) | 94 | 8.2 | 9.5~10.1 | (303~673) | Anode Buttons for CRT | ||||||
| UM-NCF47 | Alloy476 | 47Ni-6Cr-Fe | 94 | 8.3 | 9.9~10.6 | (303~673) | |||||||||
| Iron-Chromium Alloys | UM-CF18 | ASTM F256 | 18Cr-Fe | High Sealing Strength（Compared to KV,D-1,NS) | 64 | 7.7 | 10.5~11.5 | (303~623) | Shadow Mask Studpins for CRT | ||||||
| UM-CF25 | ―― | 25Cr-Fe | 70 | 7.6 | 10.2~11.2 | (303~623) | |||||||||
| Nickel-Copper Alloys | UM-NC55 | ASTM F96 | 55Ni-Cu | Easy Brazing and Non-Magnetic | 50 | 8.8 | Transmission Tubes | ||||||||
| Pure Nickel | UM-NA | ―― | Ni+Trace element | Homogeneous Composition and Little Gas Evolution | 8 | 8.9 | Tensile Strength Elongation |
≦490MPa
≧35%(Thickness Min.0.2mm）
|
Annealed
|
Cathodes of Electron tubes | |||||
| Nickel-Niob Alloys | UM-NN1 | ―― | Nb-Ni | Good Electrical Discharge Characteristics（Compared to Ni） | 25 | 8.9 | Tensile Strength Elongation |
≦720MPa
≧30%
|
Electrode of Cold Cathode | ||||||
| Nickel-Chromium Alloys | UM-CN20 | ―― | 20Cr-Ni | Excellent Deep Drawability and Non-Magnetic | 105 | 8.4 | Tensile Strength Elongation Permeability |
≦785MPa
≧20%
≦1.005
|
Annealed
|
CRT Gun Parts | |||||
| silver Solder Alloys Striped D-1 | UM-SSNF | ―― | Silver Solder |
42Ni-Fe （D-1） |
Homogeneous Thickness of Silver Solder and Easy Brazing | ―― | 8.2 | 4.5~5.3 | （303~598） | Variety of Electronic Component | |||||
| Copper Clad 36Ni-Fe Alloys | UM-CNFC36 | ―― | Cu | 36Ni-Fe | Cu | Good Electrical Conductivity and Low Thermal Expansion Coefficient（Compared to Cu） | ―― | ―― | Electrical Conductivity Tensile Strength |
10~50%IACS 392~588MPa |
Circuit Boards（Ceramic LCC),Heat Spreder | ||||
| Copper Cllad KV-2 | UM-CNCF29 | ―― | Cu |
29Ni-16Co-Fe （KV-2) |
Good Electrical Conductivity and Low Thermal Expansion Coefficient（Compared to Cu） | ―― | ―― | KV-2（Base Material） | Cu | Quartz Crystal Oscillator Cases | |||||
| Vickers Hardness（HV） | ≦200 | ≦100 | |||||||||||||
| Aluminum Clad lron | UM-AFA | ―― | Al | Fe | Al | ―― | ―― | Erichsen Value≧6 | Anodes of Electron Tubes | ||||||
| Aluminum Clad lron-Nickel Alloys | UM-ANFA36 | ―― | Al | 36Ni-Fe | Al | ―― | ―― | Heat Spreaders, Lead Materials | |||||||
| Iron Clad Copper | UM-FCF | ―― | Fe | Cu | Fe | Good Heat Dispersion Properties（Compared to Fe）and Good Sealing to Soft Glass | ―― | ―― | Laser Diode Stem | ||||||
+8613823543387
